Micro-spot EDXRF and Optical Inspection (2D-3D)
In-line non-destructive inspection and metrology for the semiconductor and micro-electronics industries
Combining advanced X-ray and optical techniques, the ONYX 3000 offers a unique wafer metrology approach in many areas from FEOL through WLP, leading to in-line solutions for these processes. This sophisticated hybrid metrology tool enables high-throughput, in-line measurements on a blanket and product wafers ranging from ultra-thin single-layer films to multi-layer stacks.
