High-speed metal contamination mapping for up to 300 mm wafers
Measurement of trace elemental surface contamination
Total reflection X-ray fluorescence (TXRF) analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 310Fab can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system.
