Wafer Surface Contamination for up to 200 mm Wafers
Measure elemental contamination at discrete points or with full wafer maps
Total reflection X-ray fluorescence (TXRF) analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system, and a liquid nitrogen-free detector system.
